Supercomputers, datacenters, and telecom networks are increasingly dependent on optical networks for high-bandwidth digital communication. While innovation in electro-optical components such as transceivers is enabling higher bandwidth and greater efficiency, there has been little innovation in the fiber-optic connectors or packaging approaches that greatly influence the cost of optical communication. This seminar describes how ultra-high precision stamping processes, capable of producing metallic parts with sub-micr ometer tolerances and microscale features, are enabling a variety of new fiber-optic connectors with outstanding optical performance, improved robustness, and lower-cost compared with conventional approaches. The seminar will introduce: 1) the enabling technologies for high-precision stamping, including HPC computer-based simulations of the stamping process, 2) new connector components for cabling and connections inside transceivers, and 3) stamped micro mirror arrays for silicon photonics.

nanoPrecision Products acknowledges partial support for this work from the SBIR program (DE-SC0009617, Richard Carlson) for the DOE Office of Advanced Scientific Computing and Research (ASCR).